additivetools

AM Process Library

10 processes · 43 defect modes · 20 parameter envelopes

Engineering-level reference for the main additive manufacturing processes. Each entry includes the forming mechanism, operating parameter ranges, defect modes with root causes, and material compatibility — all traceable to peer-reviewed sources.

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Powder Bed Fusion

(4)
Laser Powder Bed Fusion
SLMDMLSDMLMLaserCUSING
Layer: 20–100 µmTol: ±0.05–0.3 mmRa: 5–25 µmRate: 5–80 cm³/h
7 materials · 6 defect modesView →
Electron Beam Melting
EBMArcam EBMPBF-EB/MElectron Beam PBF
Layer: 50–150 µmTol: ±0.2–0.5 mmRa: 20–60 µmRate: 20–80 cm³/h
3 materials · 4 defect modesView →
Selective Laser Sintering
SLSPBF-LB/PLaser SinteringLS
Layer: 80–150 µmTol: ±0.2–0.5 mmRa: 9–20 µmRate: 50–250 cm³/h
3 materials · 4 defect modesView →
Multi Jet Fusion
MJFHP Multi Jet FusionHP Jet FusionPBF-LB/P (MJF variant)
Layer: 80–80 µmTol: ±0.2–0.4 mmRa: 8–16 µmRate: 150–2500 cm³/h
2 materials · 3 defect modesView →
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Material Extrusion

(1)
Fused Deposition Modelling
FFFFDMMEXFLM
Layer: 50–300 µmTol: ±0.1–0.5 mmRa: 5–30 µmRate: 5–60 cm³/h
2 materials · 4 defect modesView →
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Directed Energy Deposition

(2)
Directed Energy Deposition — Laser Powder
LENSLMDDMDDED-LB/P
Layer: 200–1000 µmTol: ±0.3–1.5 mmRa: 20–100 µmRate: 10–300 cm³/h
4 materials · 4 defect modesView →
Wire Arc Additive Manufacturing
WAAMDED-ArcDED-Wire/ArcGMAW-AM
Layer: 1000–10000 µmTol: ±0.5–2 mmRa: 50–200 µmRate: 300–6000 cm³/h
4 materials · 3 defect modesView →
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Vat Photopolymerisation

(2)
Stereolithography
SLASLStereolithography ApparatusLaser Stereolithography
Layer: 25–200 µmTol: ±0.05–0.2 mmRa: 1.5–8 µmRate: 5–50 cm³/h
0 materials · 5 defect modesView →
Digital Light Processing
DLPDLP-SLAProjector-based SLAVPP-DLP
Layer: 25–100 µmTol: ±0.05–0.15 mmRa: 1.5–5 µmRate: 15–150 cm³/h
0 materials · 5 defect modesView →
🖨️

Binder Jetting

(1)
Binder Jetting
BJBJ3DPBinder JetHP Metal Jet
Layer: 50–200 µmTol: ±0.3–0.5 mmRa: 5–15 µmRate: 50–3000 cm³/h
2 materials · 5 defect modesView →

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