Cu-CP (Commercially Pure Copper)
metalcopper alloy — commercially pure
Pure CopperCP CopperCu 99.9Oxygen-Free Copper AMC10100 AM
Composition — ASTM B170 / EN 13599 — Cu-ETP or Cu-OFE equivalent (>99.9 wt% Cu)
| Element | Min % | Max % | Notes |
|---|---|---|---|
| Cu | 99.90 | — | balance — >99.9 wt% minimum; purity drives electrical and thermal conductivity |
| O | — | 0.040 | Oxygen impurity forms Cu₂O inclusions, reducing conductivity and promoting porosity; strict atmosphere control mandatory |
| Fe | — | 0.050 | Iron impurity reduces electrical conductivity |
| Pb | — | 0.005 | Lead trace — minimal permitted |
Mechanical & thermal properties — 2 conditions
| Property | LPBF as-built (XY) — green laser | LPBF as-built (Z) — green laser |
|---|---|---|
| Elastic modulus | 110 GPa | 108 GPa |
| Yield strength (0.2%) | 175–230 MPa | 150–200 MPa |
| Ultimate tensile strength | 200–250 MPa | 175–220 MPa |
| Elongation at break | 25.0–40.0 % | 18.0–32.0 % |
| Hardness (HV) | 65–85 HV | — |
| Density | 8.92 g/cm³ | 8.90 g/cm³ |
| Thermal conductivity | 360.0–400.0 W/m·K | 350.0–390.0 W/m·K |
Values shown as min–max where a spread is reported, otherwise as typical ± unit. Ranges reflect inter-source variation, not single-sample scatter. All values are for AM-processed specimens unless noted.
Engineering considerations
- Laser selection: Green laser (515–532 nm) is strongly preferred. Copper absorptivity at 532 nm is ~40% vs ~5% at 1064 nm. If only IR is available, use ≥500 W with carefully optimised scan speed and hatch — expect higher porosity and require CT verification before pressure testing.
- Electrical conductivity vs porosity: Even small amounts of porosity (<1%) can degrade electrical conductivity disproportionately. Verify relative density >99% by Archimedes method or CT before deploying in electrical applications.
- No strength upgrade pathway: Cu-CP cannot be precipitation-hardened. If the application requires both high conductivity AND strength >300 MPa, specify CuCrZr (aged: ~400–500 MPa, ~320 W/m·K) or GRCop-84 (~310–380 MPa, ~323 W/m·K) instead.
- Atmosphere control: Use high-purity argon (<10 ppm O₂, <10 ppm H₂O). Copper oxidises readily at LPBF processing temperatures; Cu₂O inclusions are detrimental to both thermal and electrical conductivity.
- Thermal distortion: High thermal conductivity means rapid heat dissipation, but also that residual stresses from steep thermal gradients can be significant. Use a preheat plate (≥100°C) and consider a low-stress scan strategy (island/chessboard).
- Pressure testing: For cooling channels, proof-pressure test at 1.5× operating pressure using inert gas (He or N₂) with leak detection. Helium leak test is preferred for refrigerant circuits.
- Design wall thickness: Minimum recommended wall for conformal cooling channels: 0.4 mm (confirmed at >99% density with green laser). Thinner walls possible with parameter optimisation but require individual verification.
Advantages
- Highest thermal conductivity of any AM metal (~380–400 W/m·K at room temperature)
- Electrical conductivity ~95–100% IACS as-built with green laser — approaches wrought OFHC copper
- Excellent ductility (>25% elongation) — damage-tolerant in thermal cycling applications
- LPBF enables complex internal cooling channel geometries (conformal cooling, manifold lattices) impossible to fabricate conventionally
- No precipitation hardening needed — as-built is the final functional condition
- Well-understood corrosion behaviour — excellent in deionised water, moderate in seawater
Limitations
- Very low strength (YS ~175–200 MPa) — not a structural material; always design with a stiffer structural shell if loads are present
- Requires green laser (515 nm) LPBF for consistent high density; green-laser systems cost ~2–3× more than standard IR systems
- High-power IR (>500 W) can process Cu-CP but shows higher spatter, porosity, and parameter sensitivity vs green laser
- Strict atmosphere control required (<50 ppm O₂); oxygen contamination forms Cu₂O inclusions that degrade both conductivity and mechanical properties
- Poor wear resistance — not suitable for sliding contact or tribological applications (use CuSn10 or CuCrZr instead)
- No heat treatment pathway to increase strength — if higher strength is needed, switch to CuCrZr or GRCop-84
- Powder cost higher than 316L; Cu powder requires careful handling (moisture absorption, oxidation risk during storage)
- Machining Cu is 'gummy' — use sharp tooling, flood coolant, avoid work hardening
Typical applications
EV battery cooling plates with complex internal channels (LPBF enables geometries impossible in stamped/brazed construction)Rocket engine regenerative cooling chambers (where ultra-high thermal conductivity outweighs low strength)RF waveguides and antenna structures requiring high electrical conductivityHeat sinks and cold plates for high-power electronics and power modulesInduction heating coils with complex geometriesBusbars and electrical connectors for high-current applicationsMicrowave and RF filter housings
Industries
automotiveaerospaceelectronicsenergyindustrial
Compatible AM processes (2)
Other metal materials
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Related calculators
LPBF Porosity PredictorPredict lack-of-fusion and keyhole porosity from laser parameters. Maps VED and normalised enthalpy to relative density and flags dangerous regimes.Powder Characterisation TrackerScore a powder batch against key qualification metrics — particle size distribution, flowability, apparent/tap density, moisture, and oxygen content.Melt PoolLPBF / DED melt pool depth, width, and cooling rate from the Rosenthal moving heat source solution. Absorptivity, thermal diffusivity, and solidification velocity.Laser ParamsDerive LPBF process parameters from target VED and melt-pool stability constraints. Power–speed–hatch–layer sensitivity matrix with keyholing and balling risk zones.RoughnessTheoretical Ra and Rz from layer thickness and surface angle (staircase effect). Upward, downward, and vertical faces. LPBF, SLS, FDM, SLA, DED. Per Grimm et al.NDT SelectorSelect the right non-destructive testing method for your AM part. Inputs: material class, defect focus, geometry, production volume, and criticality. Ranked scorecard across CT, X-ray, UT, FPI, MPI, eddy current, and visual inspection with detection limits and standard references.
Last reviewed: 2026-05-15 · v1 · Sources: gu-2018-cu-lpbf, colopi-2019-cu-lpbf, jadhav-2019-cu-lpbf
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