CuCrZr
metalcopper alloy — precipitation-hardened
CuCr1ZrCopper-Chromium-ZirconiumCu-Cr-ZrCW106CUNS C18150
Composition — ISO 1337 CuCr1Zr / UNS C18150
| Element | Min % | Max % | Notes |
|---|---|---|---|
| Cu | bal. | balance | |
| Cr | 0.50 | 1.200 | Primary hardening element via Cr precipitates; reduces conductivity loss vs. Cu-Be |
| Zr | 0.03 | 0.300 | Grain boundary strengthening; improves creep resistance and conductivity retention on ageing |
| Fe | — | 0.100 | |
| Si | — | 0.100 | |
| Pb | — | 0.010 |
Mechanical & thermal properties — 3 conditions
| Property | LPBF as-built, IR laser 1070 nm (XY) | LPBF + solution anneal (980°C/1h) + age (480°C/3h) (XY) | LPBF green laser (515 nm) as-built (XY) |
|---|---|---|---|
| Yield strength (0.2%) | 160–250 MPa | 280–390 MPa | 200–290 MPa |
| Ultimate tensile strength | 230–360 MPa | 350–450 MPa | 300–410 MPa |
| Elongation at break | 10.0–28.0 % | 8.0–20.0 % | — |
| Hardness (HV) | — | 120–155 HV10 | — |
| Density | 8.90 g/cm³ | — | — |
| Relative density | 96.0–98.5 % | — | 98.8–99.7 % |
| Thermal conductivity | 220.0–280.0 W/m·K | 290.0–340.0 W/m·K | 250.0–295.0 W/m·K |
Values shown as min–max where a spread is reported, otherwise as typical ± unit. Ranges reflect inter-source variation, not single-sample scatter. All values are for AM-processed specimens unless noted.
Engineering considerations
- Laser selection: green laser (515 nm, e.g. Trumpf TruPrint 1000 Green Edition) is the recommended platform for CuCrZr LPBF. IR laser can produce acceptable parts but requires extensive parameter development and accepts lower relative density. Green laser delivers >99% relative density with less parameter sensitivity.
- Heat treatment: the full solution anneal + quench + age cycle is required for design-conductivity properties. Solution anneal at 980°C/1h in inert gas or vacuum (copper oxidises readily); water quench immediately; age at 480°C/3h. The exact quench rate is critical — slow quenching reduces precipitation hardening effectiveness.
- Conformal cooling design: minimum internal channel diameter of 1.5 mm for LPBF CuCrZr (vs. 0.8 mm for SS316L) due to partially fused powder removal difficulty. Design channels with 45° inclination where possible to minimise support need. Self-supporting arches preferred for overhead channel geometry.
- Thermal conductivity vs. density trade-off: accept lower relative density only if the application tolerates it. For rocket nozzles and high-heat-flux applications, HIP before ageing closes porosity and maximises conductivity. For conformal cooling, 97–98% density is often acceptable.
- Support structures: use thin breakaway tabs (0.1–0.2 mm effective attachment) due to the difficulty of CuCrZr machining. Copper work-hardens rapidly — use sharp carbide tools at high surface speed, low chip load.
- Residual stress: CuCrZr LPBF has lower residual stress than steel or Ni alloys due to the high thermal conductivity (faster heat dissipation). Preheat to 200°C can further reduce distortion risk for large parts.
- Powder oxidation: copper oxidises readily. Store powder in sealed containers with desiccant. Use Ar or N₂ atmosphere for all powder handling. Oxygen content in build chamber must be < 500 ppm, ideally < 200 ppm.
Advantages
- Outstanding thermal conductivity (320 W/m·K aged) — highest of any LPBF structural alloy, 25× better than IN718
- Good electrical conductivity (~80% IACS aged) — enables combined electrical + structural applications
- Age-hardenable strength — Cr precipitation raises UTS to ~400 MPa, unlike pure copper (~220 MPa)
- LPBF enables complex internal cooling channels impossible in conventional CuCrZr manufacturing (forging, rolling)
- Biocompatible and non-sparking — useful in pharmaceutical and ATEX environments
- Excellent brazeability and solderability — supports hybrid assembly with conventional copper components
Limitations
- High laser reflectivity (~95% at 1070 nm) — requires either green laser (preferred) or elevated VED that risks keyholing with IR laser
- Low relative density in IR laser LPBF (96–98.5%) vs. other LPBF metals (>99.5%) — reduces thermal conductivity from theoretical maximum
- Green laser LPBF machines are significantly more expensive and less widely available than IR laser systems
- High powder cost — atomised CuCrZr LPBF powder is 5–8× the cost of stainless steel powder
- Support removal is difficult — copper supports weld to the part surface; machining allowance for support areas is critical
- Thermal conductivity is highest after full heat treatment cycle — as-built conductivity is 20–25% lower
- Copper dust and fume is a health hazard — strict occupational hygiene controls required in powder handling areas
- No dedicated AM CuCrZr standard — higher qualification cost vs. standardised alloys
Typical applications
Conformal cooling inserts for injection moulding tools — channels follow part contour for uniform coolingRocket engine nozzle liners and combustion chamber walls — relies on conductivity to protect structure under thermal loadInduction coil formers — combines high conductivity with structural integrityHigh-power RF and microwave waveguide componentsThermal management heat sinks with complex internal flow channelsResistance welding electrodes with internal coolingCryogenic heat exchangers for liquefied gas processingHigh-current bus bar connectors with integrated cooling
Industries
aerospaceenergyindustrialmotorsport
Standards & certifications
ASTM-F3049established
Powder feedstock characterisation for LPBF CuCrZr
aerospaceenergyindustrial
No dedicated AM CuCrZr material standard exists. Process qualification follows OEM-specific qualification plans.
ISO-52904established
Process qualification for safety-critical metal PBF parts — applied to CuCrZr for aerospace applications
aerospaceenergy
Compatible AM processes (1)
Other metal materials
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Related calculators
VEDCompute LPBF VED from power, scan speed, hatch, and layer thickness. Includes process windows for common alloys.Conformal CoolingAM-enabled conformal cooling for injection moulds — heat transfer coefficient, Nusselt number (Dittus-Boelter), pressure drop (Darcy-Weisbach), and cycle time reduction vs. straight-drilled.Melt PoolLPBF / DED melt pool depth, width, and cooling rate from the Rosenthal moving heat source solution. Absorptivity, thermal diffusivity, and solidification velocity.LPBF Porosity PredictorPredict lack-of-fusion and keyhole porosity from laser parameters. Maps VED and normalised enthalpy to relative density and flags dangerous regimes.DistortionEstimate residual stress and distortion risk index (σ/σ_y) for LPBF and DED builds. Mercelis-Kruth model with preheat sensitivity table.Powder Characterisation TrackerScore a powder batch against key qualification metrics — particle size distribution, flowability, apparent/tap density, moisture, and oxygen content.Surface Treatment SelectorRank post-print surface treatments (shot peening, electropolishing, tumbling, PVD, and more) against Ra target, material, fatigue criticality, and corrosion requirements.NDT SelectorSelect the right non-destructive testing method for your AM part. Inputs: material class, defect focus, geometry, production volume, and criticality. Ranked scorecard across CT, X-ray, UT, FPI, MPI, eddy current, and visual inspection with detection limits and standard references.Laser ParamsDerive LPBF process parameters from target VED and melt-pool stability constraints. Power–speed–hatch–layer sensitivity matrix with keyholing and balling risk zones.
Last reviewed: 2026-05-13 · v1 · Sources: gkg-cucrz-2023, toro-2021-cucrz-lpbf, wegner-2021-cucrz-green, fraunhofer-ilt-lpbf-state-2022, debroy-2018-review
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